The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Aug. 16, 2012
Applicants:

Narasimhulu Kanike, Wayne, NJ (US);

Deleep R. Nair, Fishkill, NY (US);

Inventors:

Narasimhulu Kanike, Wayne, NJ (US);

Deleep R. Nair, Fishkill, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/331 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/785 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01); H01L 29/78615 (2013.01);
Abstract

A semiconductor structure including a body-contacted finFET device and methods form manufacturing the same. The method may include forming one or more semiconductor fins on a SOI substrate, forming a semiconductive body contact region connected to the bottom of the fin(s) in the buried insulator region, forming a sacrificial gate structure over the body region of the fin(s), forming a source region on one end of the fin(s), forming a drain region on the opposite end of the fin(s), replacing the sacrificial gate structure with a metal gate, and forming electrical contacts to the source, drain, metal gate, and body contact region. The method may further include forming a body contact fin contemporaneously with the finFET fins that is in contact with the body contact region, through which electrical contact to the body contact region is made.


Find Patent Forward Citations

Loading…