The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 31, 2015

Filed:

Nov. 26, 2012
Applicants:

Paul S. Gilman, Suffern, NY (US);

Binu Mathew, New City, NY (US);

Brian J. O'hara, Balston Spa, NY (US);

Thomas J. Hunt, Peekskill, NY (US);

Peter Mcdonald, Pearl River, NY (US);

Holger J. Koenigsmann, Congers, NY (US);

Inventors:

Paul S. Gilman, Suffern, NY (US);

Binu Mathew, New City, NY (US);

Brian J. O'Hara, Balston Spa, NY (US);

Thomas J. Hunt, Peekskill, NY (US);

Peter McDonald, Pearl River, NY (US);

Holger J. Koenigsmann, Congers, NY (US);

Assignee:

Praxair Technology, Inc., Danbury, CT (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/18 (2006.01); C23C 14/34 (2006.01); B23K 1/00 (2006.01); B23K 3/08 (2006.01); B23K 20/02 (2006.01); B23K 20/16 (2006.01); H01J 37/34 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B23K 1/0006 (2013.01); B23K 1/0008 (2013.01); B23K 3/087 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); H01J 37/3435 (2013.01); H01J 37/3491 (2013.01); C23C 14/3407 (2013.01);
Abstract

The present invention relates to a method and apparatus of forming a sputter target assembly having a controlled solder thickness. In particular, the method includes the introduction of a bonding foil, between the backing plate and the sputter target, wherein the bonding foil is an ignitable heterogeneous stratified structure for the propagation of an exothermic reaction.


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