The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Dec. 27, 2010
Koji Nitta, Osaka, JP;
Shinji Inazawa, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Masatoshi Majima, Osaka, JP;
Osamu Suwata, Sakata, JP;
Hiroshi Yokoyama, Sakata, JP;
Shinichi Yamagata, Sakata, JP;
Yugaku Abe, Sakata, JP;
Koji Nitta, Osaka, JP;
Shinji Inazawa, Osaka, JP;
Akihisa Hosoe, Osaka, JP;
Masatoshi Majima, Osaka, JP;
Osamu Suwata, Sakata, JP;
Hiroshi Yokoyama, Sakata, JP;
Shinichi Yamagata, Sakata, JP;
Yugaku Abe, Sakata, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
A.L.M.T. Corp., Tokyo, JP;
Abstract
There is provided a metal laminated structure in which a first metal layer containing tungsten is provided on a first surface of a second metal layer containing copper and a third metal layer containing tungsten is provided on a second surface of the second metal layer opposite to the first surface, and the first metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the first surface of the second metal layer and the third metal layer contains crystal grains of tungsten in a form of a columnar crystal extending in a direction perpendicular to the second surface of the second metal layer, and a method for producing the metal laminated structure.