The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Sep. 30, 2011
Applicants:
Masahiko Abe, Tochigi, JP;
Koji Watanabe, Tochigi, JP;
Hideaki Takahashi, Tochigi, JP;
Masahiko Kanno, Tochigi, JP;
Masaya Ito, Tochigi, JP;
Inventors:
Masahiko Abe, Tochigi, JP;
Koji Watanabe, Tochigi, JP;
Hideaki Takahashi, Tochigi, JP;
Masahiko Kanno, Tochigi, JP;
Masaya Ito, Tochigi, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 35/14 (2006.01); B23K 35/30 (2006.01); B23K 35/26 (2006.01); B23K 35/28 (2006.01); B23K 35/32 (2006.01); B23K 35/40 (2006.01); B23K 1/00 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
B23K 35/02 (2013.01); B23K 35/302 (2013.01); B23K 35/262 (2013.01); B23K 35/286 (2013.01); B23K 35/325 (2013.01); B23K 35/26 (2013.01); B23K 35/40 (2013.01); B23K 1/0016 (2013.01); B23K 1/008 (2013.01); B23K 3/0623 (2013.01); B23K 2201/42 (2013.01); H05K 3/3478 (2013.01); H05K 3/3484 (2013.01); H05K 2201/10636 (2013.01); H05K 2201/10992 (2013.01); H05K 2203/0415 (2013.01); H05K 2203/082 (2013.01);
Abstract
A solder piece that has a rectangular parallelepiped shape formed by a punching process. Any one of the four surfaces of the rectangular parallelepiped other than the surface on which the shear droop portion generated by the punching process is formed and a surface opposite to the surface on which the shear droop portion is formed is sucked surface.