The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2015
Filed:
Sep. 14, 2012
Applicants:
Manabu Sakamoto, Yokkaichi, JP;
Tetsuya Shirasu, Kawasaki, JP;
Naoki Idani, Kawasaki, JP;
Inventors:
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H01L 21/321 (2006.01); B24B 37/04 (2012.01); B24B 53/017 (2012.01); B24B 53/12 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B24B 37/042 (2013.01); B24B 53/017 (2013.01); B24B 53/12 (2013.01);
Abstract
A method for fabricating a semiconductor device includes (a) depositing an insulating film on a semiconductor substrate; (b) forming a recess in the insulating film; (c) depositing a conductive film on the insulating film while filling the recess with the conductive film; and (d) polishing the conductive film. Step (d) includes a first polishing substep of using a first polisher pad conditioned with a first dresser and a second polishing substep of using a second polisher pad conditioned with a second dresser different from the first dresser.