The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Dec. 16, 2011
Applicants:
Mustafa Özkök, Berlin, DE;
Gustavo Ramos, Berlin, DE;
Arnd Kilian, Berlin, DE;
Inventors:
Assignee:
Atotech Deutschland GmbH, Berlin, DE (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/44 (2006.01); H05K 13/04 (2006.01); H01L 23/498 (2006.01); H05K 3/24 (2006.01); H01L 23/00 (2006.01); H01B 1/02 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
H05K 13/04 (2013.01); H01L 23/49866 (2013.01); H05K 3/244 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/85 (2013.01); H01B 1/02 (2013.01); H05K 1/09 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/85464 (2013.01); H05K 2203/072 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/03464 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05664 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/14 (2013.01); H01L 23/49811 (2013.01); H01L 2224/48864 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2224/45144 (2013.01); H01L 2924/01327 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48664 (2013.01); H01L 2924/01015 (2013.01); H05K 2203/049 (2013.01); H05K 2203/095 (2013.01); H01L 2924/3025 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/85045 (2013.01); H01L 2224/85065 (2013.01); H01L 2224/85075 (2013.01); H01L 2924/20105 (2013.01); H01L 2224/05464 (2013.01);
Abstract
The present invention relates to a method of bonding a copper wire to a substrate, particularly a printed circuit board and an IC-substrate, possessing a layer assembly comprising a copper bonding portion and a palladium or palladium alloy layer and a substrate having a copper wire bonded to aforementioned layer assembly.