The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Nov. 06, 2012
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Jerome L. Cann, Jericho, VT (US);

David P. Vallett, Fairfax, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/84 (2006.01); G01N 29/04 (2006.01); G01N 33/00 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01N 29/04 (2013.01); G01N 33/00 (2013.01); G01N 2033/0095 (2013.01); G01N 2291/023 (2013.01); G01N 2291/02818 (2013.01); G01N 2291/02881 (2013.01); G01N 2291/101 (2013.01); G01R 31/2831 (2013.01);
Abstract

A method and system to map density and temperature of a chip, in situ, is disclosed. The method includes measuring a propagation time that a mechanical propagation wave travels along at least one predefined path in a substrate. The method further includes calculating an average substrate density and temperature along the at least one predefined path as a function of the propagation time and distance. The method further includes determining a defect or unauthorized modification in the substrate based on the average substrate density being different than a baseline substrate density.


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