The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Apr. 10, 2012
Shih-hung Chen, Jhudong Township, Hsinchu County, TW;
Kuang-yeu Hsieh, Hsinchu, TW;
Cheng-yuan Wang, Taipei, TW;
Shih-Hung Chen, Jhudong Township, Hsinchu County, TW;
Kuang-Yeu Hsieh, Hsinchu, TW;
Cheng-Yuan Wang, Taipei, TW;
Macronix International Co., Ltd., Hsinchu, TW;
Abstract
A semiconductor structure includes first and second chips assembled to each other. The first chip includes N of first conductive lines, M of second conductive lines disposed on the first conductive lines, N of third conductive lines perpendicularly on the second conductive lines and parallel to the first conductive lines, N of first vias connected to the first conductive lines, M sets of second vias connected to the second conductive lines, and N sets of third vias connected to the third conductive lines. The second and first conductive lines form an overlapping area. The third conductive lines and N sets of the third vias include at least two groups respectively disposed in a first and a third regions of the overlapping area. M sets of second vias include at least two groups respectively disposed in a second region and a fourth region of the overlapping area.