The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2015
Filed:
Mar. 15, 2013
Applicant:
Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;
Inventor:
Yung-Hui Wang, Kaohsiung, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01); H01L 21/66 (2006.01); H01L 27/04 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 22/14 (2013.01); H01L 27/04 (2013.01); H01L 24/73 (2013.01); H01L 2224/48465 (2013.01);
Abstract
The present invention provides a semiconductor wafer, semiconductor package and semiconductor process. The semiconductor wafer includes a substrate, at least one metal segment and a plurality of dielectric layers. The semiconductor wafer is defined as a plurality of die areas and a plurality of trench areas, each of the die areas has an integrated circuit including a plurality of patterned metal layers disposed between the dielectric layers. The trench areas are disposed between the die areas, and the at least one metal segment is disposed in the trench area and insulated from the integrated circuit of the die area.