The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Feb. 19, 2013
Applicant:

Fairchild Semiconductor Corporation, San Jose, CA (US);

Inventors:

Daniel Hahn, Portland, ME (US);

Steven Leibiger, Falmouth, ME (US);

Sunglyong Kim, Falmouth, ME (US);

Christopher Nassar, Portland, ME (US);

James Hall, Scarborough, ME (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 49/02 (2006.01); H01L 29/66 (2006.01); H01L 27/06 (2006.01); H01L 29/94 (2006.01); H01L 29/732 (2006.01);
U.S. Cl.
CPC ...
H01L 28/75 (2013.01); H01L 28/20 (2013.01); H01L 29/66181 (2013.01); H01L 27/0635 (2013.01); H01L 29/94 (2013.01); H01L 29/66272 (2013.01); H01L 29/7322 (2013.01);
Abstract

In one general aspect, a semiconductor processing method can include forming an N-type silicon region disposed within a P-type silicon substrate. The method can also include forming a field oxide (FOX) layer in the P-type silicon substrate where the FOX layer includes an opening exposing at least a portion of the N-type silicon region. The method can further include forming a reduced surface field (RESURF) oxide (ROX) layer having a first portion disposed on the exposed N-type silicon region and a second portion disposed on the FOX layer where the ROX layer includes a first dielectric layer in contact with the exposed N-type silicon region and a second dielectric layer disposed on the first dielectric layer. The method can further include forming a doped polysilicon layer having a first portion disposed on the first portion of the ROX layer and a second portion disposed on the second portion of the ROX layer.


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