The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 24, 2015

Filed:

Dec. 16, 2013
Applicant:

National Applied Research Laboratories, Taipei, TW;

Inventors:

Min-Cheng Chen, Taipei, TW;

Chang-Hsien Lin, Taipei, TW;

Chia-Yi Lin, Taipei, TW;

Tung-Yen Lai, Taipei, TW;

Chia-Hua Ho, Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/12 (2006.01); H01L 29/06 (2006.01); B82Y 10/00 (2011.01); H01L 27/06 (2006.01); H01L 21/84 (2006.01); H01L 21/8238 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 27/127 (2013.01); H01L 21/84 (2013.01); H01L 29/0665 (2013.01); B82Y 10/00 (2013.01); H01L 27/1203 (2013.01); H01L 27/0688 (2013.01); H01L 21/8238 (2013.01); H01L 27/092 (2013.01); H01L 29/0676 (2013.01);
Abstract

A thin-film transistor comprises a semiconductor panel, a dielectric layer, a semiconductor film layer, a conduct layer, a source and a drain. The semiconductor panel comprises a base, an intra-dielectric layer, at least one metal wire layer and at least one via layer. The dielectric layer is stacked on the semiconductor panel. The semiconductor film layer is stacked on the dielectric layer. The conduct layer is formed on the semiconductor film layer. The source is formed on the via of the vias that is adjacent to and connects to the gate via. The drain is formed on another via of the vias that is adjacent to and connects to the gate via. A fabricating method for a thin-film transistor with metal-gates and nano-wires is also disclosed.


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