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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8981550 B1

PDFFull Text
Date of Patent:
Mar. 17, 2015

Filed:

Dec. 21, 2012

Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same

Applicant:

Amkor Technology, Inc., Chandler, AZ (US);

Inventors:

Joon Young Park, Seoul, KR;

Jin Suk Jeong, Gyeonggi-do, KR;

Kyeong Sool Seong, Seoul, KR;

Seo Won Lee, Gyeonggi-do, KR;

Assignee:

Amkor Technology, Inc., Tempe, AZ (US);

Attorney:

McAndrews, Held & Malloy

Primary Examiner:

Alexander Oscar Williams

Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/42 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 21/50 (2013.01); H01L 24/29 (2013.01); H01L 23/42 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2924/16251 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29014 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/29078 (2013.01); H01L 2224/2919 (2013.01);
Abstract

A semiconductor package improves reliability of heat emitting performance by maintaining a heat emitting lid stacked on a top surface of a semiconductor chip at a tightly adhered state. A highly adhesive interface material and a thermal interface material are applied to the top surface of the semiconductor chip. The highly adhesive interface material insures that the heat emitting lid is bonded to the top surface while the thermal interface material insures excellent heat transfer between the top surface and the heat emitting lid.

Find Patent Forward Citations

Park, Joon. (2015). Semiconductor package with alternating thermal interface and adhesive materials and method for manufacturing the same (U.S. Patent No. 8981550). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8981550

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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