The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

May. 10, 2012
Applicants:

Thomas H. Lee, Cupertino, CA (US);

Vivek Subramanian, Redwood City, CA (US);

James M. Cleeves, Redwood City, CA (US);

Mark G. Johnson, Los Altos, CA (US);

Paul Michael Farmwald, Portola Valley, CA (US);

Igor G. Kouznetzov, Santa Clara, CA (US);

Inventors:

Thomas H. Lee, Cupertino, CA (US);

Vivek Subramanian, Redwood City, CA (US);

James M. Cleeves, Redwood City, CA (US);

Mark G. Johnson, Los Altos, CA (US);

Paul Michael Farmwald, Portola Valley, CA (US);

Igor G. Kouznetzov, Santa Clara, CA (US);

Assignee:

SanDisk 3D LLC, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/788 (2006.01); H01L 27/115 (2006.01); G11C 16/34 (2006.01); H01L 21/822 (2006.01); H01L 27/06 (2006.01); H01L 27/112 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01); H01L 29/792 (2006.01); H01L 29/861 (2006.01); H01L 27/12 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11558 (2013.01); G11C 16/3427 (2013.01); H01L 21/8221 (2013.01); H01L 27/0688 (2013.01); H01L 27/112 (2013.01); H01L 27/115 (2013.01); H01L 27/11521 (2013.01); H01L 27/11551 (2013.01); H01L 27/11556 (2013.01); H01L 27/11568 (2013.01); H01L 27/11578 (2013.01); H01L 27/11582 (2013.01); H01L 27/12 (2013.01); H01L 27/1203 (2013.01); H01L 29/42324 (2013.01); H01L 29/42332 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 29/7881 (2013.01); H01L 29/792 (2013.01); H01L 29/7926 (2013.01); H01L 29/8616 (2013.01); H01L 27/1158 (2013.01); H01L 29/7889 (2013.01);
Abstract

There is provided a monolithic three dimensional array of charge storage devices which includes a plurality of device levels, wherein at least one surface between two successive device levels is planarized by chemical mechanical polishing.


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