The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
May. 29, 2009
Applicants:
Tadahiro Ohmi, Sendai, JP;
Tetsuya Goto, Sendai, JP;
Inventors:
Tadahiro Ohmi, Sendai, JP;
Tetsuya Goto, Sendai, JP;
Assignees:
National University Corporation Tohoku University, Miyagi, JP;
Daisho Denshi Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/38 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/381 (2013.01); H05K 3/388 (2013.01); H05K 3/421 (2013.01); H05K 3/4644 (2013.01); H05K 2201/0179 (2013.01); H05K 2203/095 (2013.01);
Abstract
Adhesiveness between a wiring layer and a resin layer is improved by forming a nitrided resin layer by nitriding a surface of a substrate by plasma, and furthermore, thinly forming a copper nitride film prior to forming a copper film.