The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 17, 2015

Filed:

Feb. 24, 2011
Applicants:

Takashi Morioka, Tokyo, JP;

Naoki Taya, Tokyo, JP;

Inventors:

Takashi Morioka, Tokyo, JP;

Naoki Taya, Tokyo, JP;

Assignee:

Lintec Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/24 (2006.01); C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0267 (2013.01); C09J 2201/20 (2013.01); C09J 2423/006 (2013.01); C09J 2425/006 (2013.01); C09J 2433/006 (2013.01); C09J 2205/31 (2013.01);
Abstract

A pressure-sensitive adhesive sheet includes a base material and a pressure-sensitive adhesive layer and is formed therein with a plurality of through-holes passing through from one surface to the other surface, wherein the base material comprises a resin composition, and the resin composition contains: 50 to 88 wt % of a polyolefin-based resin (A); 10 to 48 wt % of a styrene-based resin and/or an acrylic-based resin (B) excluding the polyolefin-based resin (A); and 2.0 to 30 wt % of a pigment (C). According to such pressure-sensitive adhesive sheet, air entrapments and blisters can be prevented or removed via the through-holes and the inner diameter of the through-holes is suppressed from expanding, and thereby the pressure-sensitive adhesive sheet has a good appearance.


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