The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Apr. 23, 2014
Applicant:

Asml Holding N.v., Veldhoven, NL;

Inventors:

Samir A. Nayfeh, Shrewsbury, MA (US);

Mark Edd Williams, Amherst, NH (US);

Justin Matthew Verdirame, Cambridge, MA (US);

Assignee:

ASML Holding N.V., Veldhoven, NL;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/20 (2006.01); H01L 21/687 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
G03F 7/70716 (2013.01); G03F 7/70783 (2013.01); G03F 7/707 (2013.01); H01L 21/68714 (2013.01); H01L 21/6875 (2013.01); H01L 21/683 (2013.01); Y10S 414/141 (2013.01);
Abstract

A lithographic apparatus is described that comprises a support structure to hold an object. The object may be a patterning device or a substrate to be exposed. The support structure comprises a chuck, on which the object is supported, and an array of shear-compliant elongated elements normal to the chuck and the stage, such that first ends of the elongated elements contact a surface of the chuck and second ends of the elongated elements contact a stage. Through using the array of elongated elements, a transfer of stress between the stage and the chuck is substantially uniform, resulting in minimization of slippage of the object relative to the surface of the chuck during a deformation of the chuck due to the stress.


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