The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 10, 2015

Filed:

Nov. 08, 2011
Applicants:

Kuo-shu Chen, Hsin-Chu, TW;

Chung-hsiung Wang, Hsin-Chu, TW;

Inventors:

Kuo-Shu Chen, Hsin-Chu, TW;

Chung-Hsiung Wang, Hsin-Chu, TW;

Assignee:

Cyntec Co., Ltd., Hsin-Chu, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01H 85/44 (2006.01); H01H 85/044 (2006.01); H01H 85/055 (2006.01); H01H 85/046 (2006.01); H01H 85/041 (2006.01); H01H 85/02 (2006.01); H01H 85/46 (2006.01); H01H 69/02 (2006.01);
U.S. Cl.
CPC ...
H01H 85/044 (2013.01); H01H 85/055 (2013.01); H01H 85/0411 (2013.01); H01H 85/046 (2013.01); H01H 85/0241 (2013.01); H01H 85/463 (2013.01); H01H 69/02 (2013.01); H01H 69/022 (2013.01);
Abstract

A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.


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