The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Oct. 21, 2011
Applicants:
Pierre Bar, Grenoble, FR;
Sylvain Joblot, Bizonnes, FR;
Jean-françois Carpentier, Grenoble, FR;
Inventors:
Assignee:
STMicroelectronics S.A., Montrouge, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01P 3/08 (2006.01); H01L 23/66 (2006.01); H01L 25/065 (2006.01); H01P 5/02 (2006.01); H01L 27/00 (2006.01);
U.S. Cl.
CPC ...
H01P 3/082 (2013.01); H01L 23/66 (2013.01); H01L 25/0657 (2013.01); H01P 5/028 (2013.01); H01L 2223/6627 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06527 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A transmission line formed in a device including a stack of first and second chips having their front surfaces facing each other and wherein a layer of a filling material separates the front surface of the first chip from the front surface of the second chip, this line including: a conductive strip formed on the front surface side of the first chip in at least one metallization level of the first chip; and a ground plane made of a conductive material formed in at least one metallization level of the second chip.