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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8975002 B1

PDFFull Text
Date of Patent:
Mar. 10, 2015

Filed:

Aug. 15, 2013

Positive resist composition for immersion exposure and pattern forming method

Applicant:

Fujifilm Corporation, Minato-Ku, Tokyo, JP;

Inventors:

Kei Yamamoto, Shizuoka, JP;

Hiroshi Saegusa, Shizuoka, JP;

Assignee:

FUJIFILM Corporation, Tokyo, JP;

Attorney:

Sughrue Mion, PLLC

Primary Examiner:

Anca Eoff

Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/028 (2006.01); G03F 7/26 (2006.01); G03F 7/039 (2006.01); C09D 133/16 (2006.01); C09D 133/26 (2006.01); C09D 143/04 (2006.01); G03F 7/075 (2006.01); G03F 7/20 (2006.01);
U.S. Cl.
CPC ...
G03F 7/039 (2013.01); C09D 133/16 (2013.01); C09D 133/26 (2013.01); C09D 143/04 (2013.01); G03F 7/0045 (2013.01); G03F 7/0046 (2013.01); G03F 7/0048 (2013.01); G03F 7/0397 (2013.01); G03F 7/0758 (2013.01); G03F 7/2041 (2013.01); Y10S 430/122 (2013.01); Y10S 430/126 (2013.01);
Abstract

A positive resist composition for immersion exposure includes the following (A) to (D): (A) a resin capable of decomposing by an action of an acid to increase a solubility of the resin in an alkali developer; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a resin having at least either one of a fluorine atom and a silicon atom; and (D) a mixed solvent containing at least one kind of a solvent selected from the group consisting of solvents represented by any one of the following formulae (S1) to (S3) as defined in the specification, in which a total amount of the at least one kind of the solvent is from 3 to 20 mass % based on all solvents of the mixed solvent (D).

Find Patent Forward Citations

Yamamoto, Kei. (2015). Positive resist composition for immersion exposure and pattern forming method (U.S. Patent No. 8975002). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8975002

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