The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2015
Filed:
Oct. 24, 2011
Applicants:
Andreas Meyer, Wenzenbach, DE;
Jürgen Schulz-harder, Lauf, DE;
Inventors:
Andreas Meyer, Wenzenbach, DE;
Jürgen Schulz-Harder, Lauf, DE;
Assignee:
Rogers Germany GmbH, Eschenbach, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); C04B 37/00 (2006.01); B82Y 30/00 (2011.01); C04B 35/634 (2006.01); C04B 37/02 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
C04B 37/006 (2013.01); B82Y 30/00 (2013.01); C04B 35/63452 (2013.01); C04B 37/021 (2013.01); C04B 37/026 (2013.01); C04B 37/028 (2013.01); H01L 23/3735 (2013.01); C04B 2235/5248 (2013.01); C04B 2235/5288 (2013.01); C04B 2237/121 (2013.01); C04B 2237/124 (2013.01); C04B 2237/343 (2013.01); C04B 2237/348 (2013.01); C04B 2237/366 (2013.01); C04B 2237/368 (2013.01); C04B 2237/40 (2013.01); C04B 2237/402 (2013.01); C04B 2237/407 (2013.01); C04B 2237/62 (2013.01); C04B 2237/68 (2013.01); C04B 2237/708 (2013.01); C04B 2237/72 (2013.01);
Abstract
A metal-ceramic substrate for electrical circuits or modules includes at least one first outer metal layer forming one first surface side of the metal-ceramic substrate and at least one second outer metal layer forming one second surface side of the metal-ceramic substrate. The outer metal layers are bonded respectively by two-dimensional bonding with the surface sides of a plate-like substrate body.