The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Aug. 15, 2013
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Yuan-Te Hou, Hsinchu, TW;

Wen-Hao Chen, Hsinchu, TW;

Chin-Hsiung Hsu, Guanyin Township, TW;

Meng-Kai Hsu, Xinfeng Township, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5077 (2013.01);
Abstract

A method includes generating one or more routes usable for implementing a conductive path of an integrated circuit. A corresponding cost function value for the one or more routes is calculated according to a first cost function, including adjusting the corresponding cost function value based on whether the corresponding route is at least partially assigned to be formed in a conductive layer by a first patterning process or a second patterning process. The integrated circuit has electrical devices and the conductive layer, and the conductive layer has a first set of conductive lines formed by the first patterning process and a second set of conductive lines formed by the second patterning process. The first set of conductive lines has a unit resistance less than that of the second set of conductive lines. The conductive path electrically connects two of the electrical devices of the integrated circuit.


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