The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Mar. 03, 2009
Jong-pil Kim, Daejeon, KR;
Seung-beom Cho, Daejeon, KR;
Jun-seok Noh, Daejeon, KR;
Jang-yul Kim, Daejeon, KR;
Jong-Pil Kim, Daejeon, KR;
Seung-Beom Cho, Daejeon, KR;
Jun-Seok Noh, Daejeon, KR;
Jang-Yul Kim, Daejeon, KR;
LG Chem, Ltd., Seoul, KR;
Abstract
The present invention relates to a CMP slurry that is able to reduce dishing generation, when it is applied to polishing or planarization of silicon oxide layer, for example, and a polishing method. The CMP slurry includes a polishing abrasive, a linear anionic polymer, a compound including a phosphoric acid group, and water, and the ratio of CMP polishing speed to a silicon oxide layer: CMP polishing speed to a silicon nitride layer is 30:1 to 50:1.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile