The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Jan. 28, 2014
Applicant:

Volterra Semiconductor Corporation, Fremont, CA (US);

Inventors:

Marco A. Zuniga, Palo Alto, CA (US);

Yang Lu, Fremont, CA (US);

Badredin Fatemizadeh, Sunnyvale, CA (US);

Jayasimha Prasad, San Jose, CA (US);

Amit Paul, Sunnyvale, CA (US);

Jun Ruan, Santa Clara, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/45 (2006.01); H01L 29/49 (2006.01); H01L 29/08 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66704 (2013.01); H01L 29/7825 (2013.01); H01L 29/7802 (2013.01); H01L 29/7827 (2013.01); H01L 29/66696 (2013.01); H01L 29/7835 (2013.01); H01L 29/0626 (2013.01); H01L 21/823481 (2013.01); H01L 27/088 (2013.01); H01L 29/41766 (2013.01); H01L 29/42368 (2013.01); H01L 29/456 (2013.01); H01L 29/4933 (2013.01); H01L 29/063 (2013.01); H01L 29/0878 (2013.01); H01L 29/1083 (2013.01); H01L 29/1095 (2013.01);
Abstract

A method of fabricating a vertical gate region in LDMOS transistor includes depositing a first masking layer on an n-well region implanted on a substrate, patterning the first masking layer to define an area, depositing a second masking layer over the area, etching through the second masking layer in a first portion of the area to expose the n-well region, and etching the exposed n-well region to form a first trench. The first trench, extending from a surface of the n-well region to a first depth, is filled with an oxide. The second masking layer is etched through in a second portion of the area to expose the n-well region. A second trench is formed in the n-well, the second trench extending from the surface to a second depth, less than the first depth. An asymmetric vertical gate is formed by filling the second trench with a conductive material.


Find Patent Forward Citations

Loading…