The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Feb. 10, 2011
Applicants:

Deyuan Xiao, Shanghai, CN;

Richard Rugin Chang, Shanghai, CN;

Inventors:

Deyuan Xiao, Shanghai, CN;

Richard Rugin Chang, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 33/64 (2010.01); H01L 33/00 (2010.01); H01L 21/20 (2006.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); H01L 33/0079 (2013.01); H01L 21/2007 (2013.01); H01L 33/007 (2013.01);
Abstract

A light emitting diode (LED) and a forming method thereof are provided. The method for forming the LED includes: providing a semiconductor substrate () and a sapphire substrate () respectively, wherein a first bonding layer () is formed on the silicon substrate (), and a sacrificial layer (), an LED die () and a second bonding layer () are formed in turn on the sapphire substrate (); bonding the first bonding layer () and the second bonding layer (); removing the sacrificial layer () and lifting off the sapphire substrate (). The method increases the effective lighting area of the LED, improves heat radiation, and enhances lighting efficiency.


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