The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
May. 10, 2012
Randy A. Harris, Kalispell, MT (US);
Daniel J. Woodruff, Kalispell, MT (US);
Jeffrey I. Turner, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
Paul R. Mchugh, Kalispell, MT (US);
Randy A. Harris, Kalispell, MT (US);
Daniel J. Woodruff, Kalispell, MT (US);
Jeffrey I. Turner, Kalispell, MT (US);
Gregory J. Wilson, Kalispell, MT (US);
Paul R. McHugh, Kalispell, MT (US);
APPLIED Materials, Inc, Santa Clara, CA (US);
Abstract
An electroplating processor includes an electrode plate having a continuous flow path formed in a channel. The flow path may optionally be a coiled flow path. One or more electrodes are positioned in the channel. A membrane plate is attached to the electrode plate with a membrane in between them. Electrolyte moves through the flow path at a high velocity, preventing bubbles from sticking to the bottom surface of membrane. Any bubbles in the flow path are entrained in the fast moving electrolyte and carried away from the membrane. The electroplating processor may alternatively have a wire electrode extending through a tubular membrane formed into a coil or other shape, optionally including shapes having straight segments.