The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 03, 2015

Filed:

Mar. 08, 2011
Applicants:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Yoshinori Shirai, Sanda, JP;

Inventors:

Shoubin Zhang, Sanda, JP;

Masahiro Shoji, Sanda, JP;

Yoshinori Shirai, Sanda, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01); C23C 14/14 (2006.01); C22C 1/10 (2006.01); C22C 32/00 (2006.01); C23C 14/34 (2006.01); C23C 14/35 (2006.01); H01L 31/032 (2006.01); B22F 3/14 (2006.01);
U.S. Cl.
CPC ...
C23C 14/14 (2013.01); C22C 1/10 (2013.01); C22C 9/00 (2013.01); C22C 32/0089 (2013.01); C23C 14/3414 (2013.01); C23C 14/35 (2013.01); H01L 31/0322 (2013.01); C23C 14/3407 (2013.01); B22F 2003/145 (2013.01); Y02E 10/541 (2013.01);
Abstract

[Problems to be Solved] To provide a sputtering target that is capable of forming a Cu—Ga film to which Na is favorably added by a sputtering method, and a method for producing the same. [Means to Solve the Problems] The sputtering target is provided wherein 20 to 40 at % of Ga, 0.05 to 2 at % of Na, and 0.025 to 1.0 at % of S are contained and a remaining portion has a component composition consisting of Cu and unavoidable impurities. Also, a method for producing the sputtering target includes the step of hot pressing a mixed powder of NaS powder and Cu—Ga alloy powder or a mixed powder of NaS powder, Cu—Ga alloy powder, and pure Cu powder in a vacuum atmosphere or an inert gas atmosphere or sintering a mixed powder of NaS powder and Cu—Ga alloy powder or a mixed powder of NaS powder, Cu—Ga alloy powder, and pure Cu powder by hot isostatic pressing.


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