The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Nov. 01, 2011
Hsin-ming Hou, Tai-Nan, TW;
Ji-fu Kung, Taichung, TW;
Hsin-Ming Hou, Tai-Nan, TW;
Ji-Fu Kung, Taichung, TW;
United Microelectronics Corp., Science-Based Industrial Park, Hsin-Chu, TW;
Abstract
A wafer fabrication outcome, such as wafer yield or wafer lifetime, is predicted by excluding uncontrollable but measurable internal/external noises of a DOE system, and by rendering relations between wafer design variables and wafer outcome outputs to be more causal, as well as the relations between variances for each of the wafer design variables and the wafer outcome outputs. With the aid of a wafer fabrication outcome predicting model formed by the more causal relations, precision of predicting wafer outcomes can be raised, and performance of wafer fabrication can be thus raised as a result.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile