The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Jan. 24, 2013
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/00 (2006.01); H01L 23/367 (2006.01); H01L 21/50 (2006.01); H01L 23/473 (2006.01); H01L 23/00 (2006.01); H01L 25/07 (2006.01); H01L 23/24 (2006.01); H01L 23/373 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/367 (2013.01); H01L 23/3677 (2013.01); H01L 21/50 (2013.01); H01L 23/473 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 25/072 (2013.01); H01L 2924/1301 (2013.01); H01L 2224/40227 (2013.01); H01L 23/24 (2013.01); H01L 23/3735 (2013.01); H01L 23/3736 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/45 (2013.01); H01L 24/73 (2013.01); H01L 24/85 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48132 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/48599 (2013.01); H01L 2224/48699 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/85205 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01051 (2013.01); H01L 2924/01068 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13062 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/19107 (2013.01); H01L 2224/40247 (2013.01); H01L 23/3135 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/291 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83464 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01028 (2013.01); H01L 23/4006 (2013.01); H01L 24/49 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/4846 (2013.01); H01L 2224/8584 (2013.01); H01L 2224/293 (2013.01);
Abstract
A semiconductor device includes a semiconductor chip joined with a substrate and a base plate joined with the substrate. The base plate includes a first metal layer clad to a second metal layer. The second metal layer is deformed to provide a pin-fin or fin cooling structure. The second metal layer has a sub-layer that has no pins and no pin-fins. The first metal layer has a first thickness and the sub-layer has a second thickness. The ratio between the first thickness and the second thickness is at least 4:1.