The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Aug. 09, 2012
Cheng-po Yu, Taoyuan County, TW;
Shang-feng Huang, Taoyuan County, TW;
Chang-ming Lee, Taoyuan County, TW;
Young-sheng Bai, Taoyuan County, TW;
Cheng-Po Yu, Taoyuan County, TW;
Shang-Feng Huang, Taoyuan County, TW;
Chang-Ming Lee, Taoyuan County, TW;
Young-Sheng Bai, Taoyuan County, TW;
Unimicron Technology Corp., Taoyuan, TW;
Abstract
A circuit board and a manufacturing method thereof are provided. According to the method, a dielectric layer is formed on a dielectric substrate, and the dielectric layer contains active particles. A surface treatment is performed on a surface of the dielectric first conductive layer is formed on the activated surface of the dielectric layer. A conductive via is formed in the dielectric substrate and the dielectric layer. A patterned mask layer is formed on the first conductive layer, in which the patterned mask layer exposes the conductive via and a part of the first conductive layer. A second conductive layer is formed on the first conductive layer and conductive via exposed by the patterned mask layer. The patterned mask layer and the first conductive layer below the patterned mask layer are removed.