The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2015

Filed:

Sep. 30, 2013
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventors:

Jun Huang, Shanghai, CN;

Zhibiao Mao, Shanghai, CN;

Ermin Chong, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/469 (2006.01); H01L 21/311 (2006.01); H01L 21/027 (2006.01); H01L 21/3213 (2006.01); H01L 21/033 (2006.01); H01L 21/308 (2006.01); H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); H01L 21/0273 (2013.01); H01L 21/0274 (2013.01); H01L 21/32139 (2013.01); H01L 21/0337 (2013.01); H01L 21/3088 (2013.01); H01L 21/28123 (2013.01); H01L 21/0338 (2013.01);
Abstract

The present invention provides method of manufacturing dual gate oxide devices. The method comprises coating photoresist on the substrate which is deposited by an oxide thin film; removing some of the photoresist by exposure and development to divide the oxide thin film into a first area to be etched and a second area coated by the remained photoresist; coating RELACS material on the remained photoresist and heating to form a protective film based on the crosslinking reaction between the RELACS material and the high molecular compounds in the photoresist; performing UV radiation to strengthen and cure the protective film; removing the oxide thin film in the first area by etching and removing the remained photoresist; and depositing again an oxide firm to form an oxide layer of different thickness in the first area and the second area so as to form a dual gate oxide structure.


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