The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Dec. 23, 2013
Applicant:
SK Hynix Inc., Icheon, KR;
Inventors:
Keun Do Ban, Yongin, KR;
Jung Gun Heo, Icheon, KR;
Cheol Kyu Bok, Pohang, KR;
Myoung Soo Kim, Seongnam, KR;
Assignee:
SK Hynix Inc., Icheon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/302 (2006.01); H01L 21/308 (2006.01); H01L 27/24 (2006.01); H01L 27/108 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3086 (2013.01); H01L 27/24 (2013.01); H01L 27/10844 (2013.01); H01L 21/3081 (2013.01); H01L 21/3088 (2013.01);
Abstract
The method includes forming an array of first separation walls on an underlying layer. A block co-polymer (BCP) layer is formed to fill inside regions of the first separation walls and gaps between the first separation walls. The BCP layer is phase-separated to include first domains that provide second separation walls covering inner sidewalls and outer sidewalls of the first separation walls and second domains that are separated from each other by the first domains.