The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2015
Filed:
Aug. 15, 2011
Applicants:
Ayao Niki, Ogaki, JP;
Kazuhisa Kitajima, Ogaki, JP;
Inventors:
Ayao Niki, Ogaki, JP;
Kazuhisa Kitajima, Ogaki, JP;
Assignee:
Ibiden Co., Ltd., Ogaki-shi, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01); H05K 3/00 (2006.01); H05K 1/11 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4682 (2013.01); H05K 3/0058 (2013.01); H05K 1/113 (2013.01); H05K 3/025 (2013.01); H05K 3/06 (2013.01); H05K 3/108 (2013.01); H05K 2201/096 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/1536 (2013.01);
Abstract
A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.