The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8957483 B1

Date of Patent:

Feb. 17, 2015

Filed:

Jun. 05, 2013

Electrically conductive lines and integrated circuitry comprising a line of recessed access devices

Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventor:

Brent Gilgen, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:

Wells St. John, P.S.

Primary Examiner:

Elias M Ullah

Int. Cl.

CPC ...

H01L 27/088 (2006.01); H01L 23/48 (2006.01); H01L 21/74 (2006.01); H01L 23/535 (2006.01); H01L 29/78 (2006.01);

U.S. Cl.

CPC ...

H01L 23/48 (2013.01); H01L 21/743 (2013.01); H01L 23/535 (2013.01); H01L 29/78 (2013.01); H01L 2924/0002 (2013.01);

Abstract

A method of forming an electrically conductive buried line and an electrical contact thereto includes forming of a longitudinally elongated conductive line within a trench in substrate material. A longitudinal end part thereof within the trench is of spoon-like shape having a receptacle. The receptacle is filled with conductive material. Insulative material is formed over the conductive material that is within the receptacle. A contact opening is formed over the conductive material that is within the receptacle. Conductor material is formed in the contact opening in electrical connection with the second conductive material that is within the receptacle. Other method and device implementations are disclosed.

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