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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8956546 B1

PDFFull Text
Date of Patent:
Feb. 17, 2015

Filed:

Aug. 02, 2011

Substrate processing method and substrate processing apparatus

Applicants:

Hajime Ugajin, Yamanashi, JP;

Shigeki Tozawa, Yamanashi, JP;

Inventors:

Hajime Ugajin, Yamanashi, JP;

Shigeki Tozawa, Yamanashi, JP;

Assignee:

Tokyo Electron Limited, Tokyo, JP;

Attorney:

Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Lan Vinh

Assistant Examiner:

Maki Angadi

Int. Cl.
CPC ...
B44C 1/22 (2006.01); H01L 21/302 (2006.01); H01L 21/311 (2006.01); H01L 21/67 (2006.01); H01L 21/677 (2006.01); H01L 21/762 (2006.01); H01L 27/115 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 21/302 (2013.01); H01L 21/31116 (2013.01); H01L 21/67069 (2013.01); H01L 21/67201 (2013.01); H01L 21/67745 (2013.01); H01L 21/76224 (2013.01); H01L 27/11521 (2013.01); H01L 29/66825 (2013.01); H01L 29/66833 (2013.01); H01L 21/76283 (2013.01);
Abstract

A substrate processing method for removing an Si-based film on a surface of a substrate accommodated in a processing chamber includes a first step in which the Si-based film on the surface of the substrate is transformed into a reaction product by a gas containing a halogen element and an alkaline gas in the processing chamber and a second step in which the reaction product is vaporized in the processing chamber which is depressurized to a pressure lower than a pressure during the first step. The first step and the second step are repeated two or more times.

Find Patent Forward Citations

Ugajin, Hajime. (2015). Substrate processing method and substrate processing apparatus (U.S. Patent No. 8956546). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8956546

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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