The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Aug. 20, 2012
Takahiro Sato, Tokyo, JP;
Yuya Ishima, Tokyo, JP;
Shusaku Umemoto, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Satoru Okamoto, Tokyo, JP;
Yoshikazu Sakaguchi, Tokyo, JP;
Takahiro Sato, Tokyo, JP;
Yuya Ishima, Tokyo, JP;
Shusaku Umemoto, Tokyo, JP;
Takashi Suzuki, Tokyo, JP;
Satoru Okamoto, Tokyo, JP;
Yoshikazu Sakaguchi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
In the laminated coil component, the grain diameter of the coil conductors is 10 μm to 22 μm after baking is completed. When the grain diameter of the coil conductors is set to be 10 μm or larger after baking is completed, surface roughness of the coil conductors can be reduced to such an extent that a satisfactory Q value can be obtained at a high frequency. In addition, when the grain diameter of the coil conductors is set to be 22 μm or smaller after baking is completed, metal of the coil conductors can be refrained from being rapidly melted down during baking. Accordingly, a high Q value can be obtained while a high quality is ensured.