The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 10, 2015

Filed:

Feb. 07, 2013
Applicant:

Fujitsu Semiconductor Limited, Yokohama-shi, Kanagawa, JP;

Inventors:

Masaki Haneda, Kawasaki, JP;

Akiyoshi Hatada, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/41 (2006.01); H01L 29/417 (2006.01); H01L 29/45 (2006.01); H01L 27/088 (2006.01); H01L 29/66 (2006.01); H01L 21/8234 (2006.01); H01L 29/49 (2006.01); H01L 29/51 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 27/088 (2013.01); H01L 29/66477 (2013.01); H01L 21/823475 (2013.01); H01L 29/456 (2013.01); H01L 29/665 (2013.01); H01L 29/6659 (2013.01); H01L 29/4933 (2013.01); H01L 29/495 (2013.01); H01L 29/513 (2013.01); H01L 29/517 (2013.01); H01L 29/7843 (2013.01); H01L 29/7848 (2013.01);
Abstract

A semiconductor device including a first insulation film including a first opening reaching a diffusion region of a transistor; a first barrier metal over the diffused region in the first opening; a first conduction layer formed over the first barrier metal in the first opening and formed of a first conductor; a second barrier metal formed over the first conduction layer in the first opening; a second conduction layer formed over the second barrier metal in the first opening and formed of a second conductor; a third barrier metal formed over the first gate electrode in the second opening; a fourth barrier metal formed in the second opening and contacting with the third barrier metal; and a third conduction layer formed of the second conductor contacting with the fourth barrier metal in the second opening.


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