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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8952525 B1

PDFFull Text
Date of Patent:
Feb. 10, 2015

Filed:

Mar. 04, 2011

Semiconductor module and method for manufacturing semiconductor module

Applicants:

Eiichi Ide, Hitachi, JP;

Takeshi Tokuyama, Hitachi, JP;

Nobutake Tsuyuno, Naka-gun, JP;

Kinya Nakatsu, Hitachinaka, JP;

Tokihito Suwa, Hitachinaka, JP;

Yuujiro Kaneko, Hitachinaka, JP;

Inventors:

Eiichi Ide, Hitachi, JP;

Takeshi Tokuyama, Hitachi, JP;

Nobutake Tsuyuno, Naka-gun, JP;

Kinya Nakatsu, Hitachinaka, JP;

Tokihito Suwa, Hitachinaka, JP;

Yuujiro Kaneko, Hitachinaka, JP;

Assignee:

Hitachi Automotive Systems, Ltd., Hitachinaka-shi, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Long K Tran

Assistant Examiner:

Jordan Klein

Int. Cl.
CPC ...
H01L 23/367 (2006.01); H01L 21/52 (2006.01); H01L 23/36 (2006.01); H01L 23/42 (2006.01); H01L 23/495 (2006.01); H01L 23/433 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/373 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3675 (2013.01); H01L 23/36 (2013.01); H01L 23/42 (2013.01); H01L 23/49575 (2013.01); H01L 23/433 (2013.01); H01L 21/52 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2224/40137 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73221 (2013.01); H01L 2224/40247 (2013.01); H01L 23/3107 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 2224/45124 (2013.01); H01L 2224/45144 (2013.01); H01L 23/3735 (2013.01); H01L 2924/30107 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A semiconductor module includes a case including a receiving space that is formed by a frame portion and a pair of wall portions disposed to face each other with the frame portion therebetween. The wall portion includes a heat-dissipation portions and a support wall that supports the heat-dissipation portions at the frame portion, and the wall portion includes a heat-dissipation portion and a support wall that supports the heat-dissipation portion at the frame portion. The heat-dissipation portions provided at the wall portion are separately provided by being disposed to face a plurality of semiconductor device blocks respectively. A plurality of separate heat-dissipation portions is surrounded by the support wall, the support wall is deformed to recessed from the frame portion through the separate heat-dissipation portions inside the case such that a plurality of insulating sheets is closely joined to a plurality of lead frames and the plurality of heat-dissipation portions.

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