The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Dec. 11, 2012
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Tatsuaki Denda, Nagano, JP;
Kazutaka Kobayashi, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/60 (2010.01); H05K 1/02 (2006.01); H01L 21/50 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H05K 1/0265 (2013.01); H01L 21/50 (2013.01); H05K 1/0203 (2013.01); H05K 1/0274 (2013.01); H05K 1/111 (2013.01); H05K 2201/098 (2013.01); H05K 2201/099 (2013.01); H05K 2201/10106 (2013.01); H05K 2201/2054 (2013.01); H05K 2201/09409 (2013.01);
Abstract
A light-emitting element mounting package includes a light-emitting element mounting portion that includes a plurality of wiring portions arranged interposing a predetermined gap between the wiring portions facing each other, and an insulating layer on which the light-emitting element mounting portion is mounted, wherein an upper surface of the light-emitting element mounting portion is exposed on the insulating layer, wherein cutout portions are formed on lower sides of side edges of the wiring portions and contact the insulating layer.