The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Dec. 13, 2013
Applicant:
Fujitsu Limited, Kawasaki-shi, Kanagawa, JP;
Inventors:
Masaharu Furuyama, Kawasaki, JP;
Daisuke Mizutani, Kawasaki, JP;
Seiki Sakuyama, Kawasaki, JP;
Toshiya Akamatsu, Kawasaki, JP;
Assignee:
Fujitsu Limited, Kawasaki, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/14 (2006.01); H05K 7/00 (2006.01); H05K 5/00 (2006.01); H05K 7/04 (2006.01); H05K 3/10 (2006.01); H01L 23/498 (2006.01); H05K 3/24 (2006.01); H05K 3/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/10 (2013.01); H01L 23/49811 (2013.01); H05K 3/244 (2013.01); H01L 2924/15311 (2013.01); H05K 3/3436 (2013.01); H05K 3/3463 (2013.01); H05K 2203/1105 (2013.01); H01L 2924/0002 (2013.01);
Abstract
There is provided a circuit board to which a solder ball composed of a lead (Pb)-free solder is to be connected, a semiconductor device including an electrode and a solder ball composed of a lead (Pb)-free solder disposed on the electrode, and a method of manufacturing the semiconductor device, in which mounting reliability can be improved by enhancing the bonding strength (adhesion strength) between the solder ball composed of a lead (Pb)-free solder and the electrode.