The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Jul. 22, 2011
Applicants:
Sven Beyer, Dresden, DE;
Berthold Reimer, Dresden, DE;
Falk Graetsch, Dresden, DE;
Inventors:
Assignee:
GLOBALFOUNDRIES Inc., Grand Cayman, KY;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/4763 (2006.01); H01L 21/28 (2006.01); H01L 21/311 (2006.01); H01L 21/3213 (2006.01); H01L 29/423 (2006.01); H01L 29/78 (2006.01); H01L 29/51 (2006.01);
U.S. Cl.
CPC ...
H01L 21/28114 (2013.01); H01L 21/31111 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 29/42376 (2013.01); H01L 29/7833 (2013.01); H01L 29/51 (2013.01); H01L 29/513 (2013.01);
Abstract
In sophisticated semiconductor devices, the encapsulation of sensitive gate materials, such as a high-k dielectric material and a metal-containing electrode material, which are provided in an early manufacturing stage may be achieved by forming an undercut gate configuration. To this end, a wet chemical etch sequence is applied after the basic patterning of the gate layer stack, wherein at least ozone-based and hydrofluoric acid-based process steps are performed in an alternating manner, thereby achieving a substantially self-limiting removal behavior.