The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2015
Filed:
Jul. 09, 2013
Applicant:
Ebara Corporation, Tokyo, JP;
Inventors:
Assignee:
Ebara Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/306 (2006.01); H01L 21/3105 (2006.01); H01L 21/321 (2006.01); B24B 37/013 (2012.01); B24B 37/04 (2012.01); G01B 7/06 (2006.01); G01B 11/06 (2006.01); H01L 21/762 (2006.01);
U.S. Cl.
CPC ...
H01L 21/30625 (2013.01); H01L 22/12 (2013.01); H01L 21/31053 (2013.01); H01L 21/3212 (2013.01); B24B 37/013 (2013.01); B24B 37/042 (2013.01); G01B 7/105 (2013.01); G01B 11/0625 (2013.01); G01B 11/0683 (2013.01); H01L 22/20 (2013.01); H01L 21/76224 (2013.01);
Abstract
A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type film thickness measuring device prior to cleaning and drying of the substrate; measuring a thickness of the film by the wet-type film thickness measuring device; comparing the thickness with a predetermined target value; and if the thickness has not reached the predetermined target value, performing re-polishing of the substrate in the polishing section prior to cleaning and drying of the substrate.