The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Jan. 25, 2011
Applicants:

Yung-huei Lee, Danshui, TW;

Chou-jie Tsai, Tainan, TW;

Chia-fang Wu, Tainan, TW;

Wei-cheng Chu, Tainan, TW;

Inventors:

Yung-Huei Lee, Danshui, TW;

Chou-Jie Tsai, Tainan, TW;

Chia-Fang Wu, Tainan, TW;

Wei-Cheng Chu, Tainan, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/522 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/522 (2013.01); H01L 23/291 (2013.01); H01L 23/3192 (2013.01); H01L 23/552 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Integrated Circuits and methods for reducing thermal neutron soft error rate (SER) of a digital circuit are provided by doping a protection layer on top of the metal layer and in physical contact with the metal layer of the digital circuit, wherein the protection layer is doped with additional thermal neutron absorbing material. The thermal neutron absorbing material can be selected from the group consisting of Gd, Sm, Cd, B, and combinations thereof. The protection layer may comprise a plurality of sub-layers among which a plurality of them containing additional thermal neutron absorbing material.


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