The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2015

Filed:

Mar. 15, 2013
Applicant:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Young-jo Tak, Hwaseong-si, KR;

Jae-kyun Kim, Hwaseong-si, KR;

Joo-sung Kim, Seongnam-si, KR;

Jun-youn Kim, Hwaseong-si, KR;

Jae-won Lee, Seoul, KR;

Hyo-ji Choi, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/267 (2006.01); H01L 21/02 (2006.01); H01L 29/20 (2006.01);
U.S. Cl.
CPC ...
H01L 29/267 (2013.01); H01L 21/02104 (2013.01); H01L 29/2003 (2013.01); H01L 21/02381 (2013.01); H01L 21/02458 (2013.01); H01L 21/02505 (2013.01); H01L 21/02507 (2013.01); H01L 21/0251 (2013.01); H01L 21/0254 (2013.01);
Abstract

A semiconductor buffer structure may include a silicon substrate and a buffer layer that is formed on the silicon substrate. The buffer layer may include a first layer, a second layer formed on the first layer, and a third layer formed on the second layer. The first layer may include AlInGaN (0≦x≦1, 0≦y≦1, 0≦x+y≦1) and have a lattice constant LP1 that is smaller than a lattice constant LP0 of the silicon substrate. The second layer may include AlInGaN (0≦x<1, 0≦y<1, 0≦x+y<1) and have a lattice constant LP2 that is greater than the lattice constant LP1 and smaller than the lattice constant LP0. The third layer may include AlInGaN (0≦x<1, 0≦y<1, 0≦x+y<1) and have a lattice constant LP3 that is greater than the lattice constant LP1 and smaller than the lattice constant LP2.


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