The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Feb. 07, 2014
Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa-ken, JP;
Takeshi Matsushita, Matsumoto, JP;
Eiji Mochizuki, Matsumoto, JP;
Tatsuo Nishizawa, Matsumoto, JP;
Shunsuke Saito, Tokyo, JP;
Fuji Electric Co., Ltd., Kawasaki-shi, JP;
Abstract
A soldering method achieves little void and good joint condition in soldering an insulated circuit board and a semiconductor chip using a tin-high antimony solder material. A method of manufacturing a semiconductor device includes the steps of preparing a solder plate having a U-shape; mounting the solder plate on a substrate; mounting a semiconductor chip on the solder plate; fusing the solder plate in a reducing gas atmosphere; and reducing a pressure of the reducing gas atmosphere to a pressure lower than the atmospheric pressure when melting the solder plate.