The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Dec. 14, 2012
Applicants:

Keiko Ariyoshi, Okayama-ken, JP;

Takuma Suzuki, Kanagawa-ken, JP;

Takashi Shinohe, Kanagawa-ken, JP;

Inventors:

Keiko Ariyoshi, Okayama-ken, JP;

Takuma Suzuki, Kanagawa-ken, JP;

Takashi Shinohe, Kanagawa-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/15 (2006.01); H01L 29/16 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/04 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); H01L 29/49 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1608 (2013.01); H01L 29/66666 (2013.01); H01L 29/7827 (2013.01); H01L 21/049 (2013.01); H01L 29/517 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); H01L 29/42368 (2013.01); H01L 29/4925 (2013.01); H01L 29/4975 (2013.01); H01L 29/512 (2013.01);
Abstract

According to one embodiment, a semiconductor device includes a first, a second, a third, a fourth semiconductor region, a control electrode, and an insulating film. The first region contains silicon carbide. The second region is provided on the first region and contains silicon carbide. The third region is provided on the second region and contains silicon carbide. The fourth region is provided on the third region and contains silicon carbide. The control electrode is provided in a trench. The trench is formed in the fourth, the third, and the second semiconductor region. The insulating film is provided between a side surface of the trench and the control electrode. The insulating film contains a high-dielectric constant region. The high-dielectric constant region contacts with at least the third semiconductor region. The high-dielectric constant region has a higher dielectric constant than a dielectric constant of silicon oxide.


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