The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 27, 2015

Filed:

Jul. 20, 2011
Applicants:

Srinivas D. Nemani, Sunnyvale, CA (US);

Yifeng Zhou, Fremont, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Ellie Yieh, San Jose, CA (US);

Inventors:

Srinivas D. Nemani, Sunnyvale, CA (US);

Yifeng Zhou, Fremont, CA (US);

Dmitry Lubomirsky, Cupertino, CA (US);

Ellie Yieh, San Jose, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/3105 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/3105 (2013.01); H01L 21/31138 (2013.01); H01L 21/31144 (2013.01); H01L 21/76802 (2013.01); H01L 21/76811 (2013.01); H01L 21/76813 (2013.01); H01L 21/76826 (2013.01); H01L 21/02126 (2013.01); H01L 21/02203 (2013.01);
Abstract

Methods of multiple patterning of low-k dielectric films are described. For example, a method includes forming and patterning a first mask layer above a low-k dielectric layer, the low-k dielectric layer disposed above a substrate. A second mask layer is formed and patterned above the first mask layer. A pattern of the second mask layer is transferred at least partially into the low-k dielectric layer by modifying first exposed portions of the low-k dielectric layer with a first plasma process and removing the modified portions of the low-k dielectric layer. Subsequently, a pattern of the first mask layer is transferred at least partially into the low-k dielectric layer by modifying second exposed portions of the low-k dielectric layer with a second plasma process and removing the modified portions of the low-k dielectric layer.


Find Patent Forward Citations

Loading…