The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 20, 2015
Filed:
Sep. 14, 2012
Thomas J. Brunschwiler, Thalwil, CH;
Evan G. Colgan, Chestnut Ridge, NY (US);
Michael J. Ellsworth, Jr., Poughkeepsie, NY (US);
Werner Escher, Zurich, CH;
Ingmar G. Meijer, Zurich, CH;
Stephan Paredes, Zurich, CH;
Gerd Schlottig, Zurich, DE;
Martin Witzig, Horgen, CH;
Jeffrey A. Zitz, Poughkeepsie, NY (US);
Thomas J. Brunschwiler, Thalwil, CH;
Evan G. Colgan, Chestnut Ridge, NY (US);
Michael J. Ellsworth, Jr., Poughkeepsie, NY (US);
Werner Escher, Zurich, CH;
Ingmar G. Meijer, Zurich, CH;
Stephan Paredes, Zurich, CH;
Gerd Schlottig, Zurich, DE;
Martin Witzig, Horgen, CH;
Jeffrey A. Zitz, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.