The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Mar. 16, 2012
Ygdal Naouri, Jerusalem, IL;
Ygdal Naouri, Jerusalem, IL;
Intel Corporation, Santa Clara, CA (US);
Abstract
An embodiment may include at least one die produced, at least in part, from a wafer, and may include at least one integrated circuit and/or at least one other integrated circuit. These integrated circuits may be mutual replications of each other and may include respective core and additional blocks. Each respective core block may have an associated respective capability. As formed in the wafer, the respective additional blocks may be coupled together so as to permit the associated respective capabilities of the respective core blocks to be functionally combined to provide an increased capability relative to each of the associated respective capabilities considered separately, and also so as to permit the integrated circuits to be externally interfaced as a unified device. The wafer may be separable into respective dice including respective of the integrated circuits such that the integrated circuits include respective external interfaces. Many modifications are possible.