The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 13, 2015
Filed:
Nov. 21, 2013
Jia Lin Yap, Klang, MY;
Yin Kheng AU, Petaling Jaya, MY;
Ahmad Termizi Suhaimi, Bandar Sunway, MY;
Seng Kiong Teng, Shah Alam, MY;
Boon Yew Low, Petaling Jaya, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
Jia Lin Yap, Klang, MY;
Yin Kheng Au, Petaling Jaya, MY;
Ahmad Termizi Suhaimi, Bandar Sunway, MY;
Seng Kiong Teng, Shah Alam, MY;
Boon Yew Low, Petaling Jaya, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A lead frame for a packaged semiconductor device has multiple, configurable power bars that can be selectively electrically connected, such as with bond wires, to each other and/or to other leads of the lead frame to customize the lead frame for different package designs. One or more of the configurable power bars may extend into one or more cut-out regions in a die paddle of the lead frame, which allows for short bond wires to be used to connect the power bars to die pads of a semiconductor die mounted on the die paddle.