The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 13, 2015

Filed:

Apr. 24, 2012
Applicants:

Shijin Ding, Shanghai, CN;

Sun Chen, Shanghai, CN;

Xingmei Cui, Shanghai, CN;

Pengfei Wang, Shanghai, CN;

Wei Zhang, Shanghai, CN;

Inventors:

Shijin Ding, Shanghai, CN;

Sun Chen, Shanghai, CN;

Xingmei Cui, Shanghai, CN;

Pengfei Wang, Shanghai, CN;

Wei Zhang, Shanghai, CN;

Assignee:

Fudan University, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/792 (2006.01); H01L 29/66 (2006.01); H01L 29/788 (2006.01);
U.S. Cl.
CPC ...
H01L 29/792 (2013.01); H01L 29/66742 (2013.01); H01L 29/66833 (2013.01); H01L 29/66825 (2013.01); H01L 29/7881 (2013.01);
Abstract

The invention relates to a thin film transistor memory and its fabricating method. This memory using the substrate as the gate electrode from bottom to up includes a charge blocking layer, a charge storage layer, a charge tunneling layer, an active region of the device and source/drain electrodes. The charge blocking layer is the ALD grown AlOfilm. The charge storage layer is the two layer metal nanocrystals which include the first layer metal nanocrystals, the insulating layer and the second layer metal nanocrystals grown by ALD method in sequence from bottom to up. The charge tunneling layer is the symmetrical stack layer which includes the SiO/HfO/SiOor AlO/HfO/AlOfilm grown by ALD method in sequence from bottom to up. The active region of the device is the IGZO film grown by the RF sputtering method, and it is formed by the standard lithography and wet etch method. The TFT memory in this invention has the advantage with large P/E window, good data retention, high P/E speed, stable threshold voltage and simple fabricating process.


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